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**Tech-Requirements:

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Layers: 2

Base Material: FR4

Board Thickness: 1.6mm

Copper Thickness: 1 oz

Min vias: 0.2mm

Min Tracing Width / Space: 4 mil

Soldermask: Green

Legends: White

Finishing: HASL

Lead Time: 3-5Days

** RoHS Compliance.

  

**Fabric Capacity:

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NO Item Craft Capacity 1 Layer 1-28 Layers 2 Base Material for PCB FR4, CEM-1, Aluminium, High Tg MaterialHigh FrequenceROGERS ,TEFLON ,TACONIC ,ARLON) Halogen-free Material 3 Rang of finish baords Thickness 0.21-7.0mm 4 Max size of finish board 900MM*900MM 5 Minimum Linewidth 3mil 6 Minimum Line space 3mil 7 Min space between pad to pad 3mil 8 Minimum hole diameter 0.10 mm 9 Min bonding pad diameter 10mil 10 Max proportion of drilling hole and board thickness 1:12.5 11 Minimum linewidth of Idents 4mil 12 Min Height of Idents 25mil 13 Finishing Treatment HASL (Tin-Lead Free),  ENIG(Immersion Gold), Immersion Silver , Gold Plating (Flash Gold), OSP, etc. 14 Soldermask Green, White, Red, Yellow, Black, Blue, transparent photosensitive soldermask, Strippable soldermask. 15 Minimun thickness of soldermask 10um 16 Color of silk-screen White, Black, Yellow ect. 17 E-Testing 100% E-Testing High Voltage Testing;  Flying Probe Testing  18 Other test Impedance,,Testing,Resistance,,Testing, Microsection etc., 19 Date file format GERBER FILE and DRILLING FILE, PROTEL SERIES, PADS2000 SERIES, Powerpcb SERIES, ODB++ 20 Special technological requirement Blind & Buried Vias and High Thickness copper

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PCB Sample